Gary Dickerson
President and CEO
Yeah, thanks for the question C.J. Let me give you some color on market share. And I think it's useful to think about three timeframes, what we've done, what we see today and where we're going. When I joined Applied in 2012, we substantially shifted investment towards big inflections. As a result in the 6 years to 2017, we held or increased share for 6 consecutive years. I think we were up five years and flat one. And also, we increased share in memory, where we had a big focus. So we increased our total share of memory spending by about 10 points. So in the near term, as I talked about in the prepared remarks, 2018 we're gaining or holding share in the vast majority of our businesses, but we also see rapid growth in EUV and also in other markets where we don't compete. So as a result, we do expect our share to decline in 2018. After many years of development, we expect to see the first EUV tools used in production beginning in 2019. Those tools have very long lead times and to support the initial adoption, we expect high spending in 2018 and 2019, creating a mix headwind for our overall WFE share. Of course, those long lead-time shipments also are a positive indicator for our future business. And another thing you talked C.J. about mix and other important near-term factor to think about is 3D NAND spending. Once that recovers, the mix will become a lot more favorable for us. And then over - the last thing is over the longer term, over the last couple of months I've spent time with many customers, and still believe that the industry needs a new playbook beyond 2D scaling. And I deeply believe that Applied is in the best position to enable this new playbook. I heard this from all of the customers I met over the last couple of months. And we've all seen classic Moore's Law scaling slowing. All the customers in the industry want more ways to drive PPAC, power, performance, area and cost. So as we've communicated before, we're driving a new playbook that includes five different techniques that I've been talking about, including developing entirely new chip architectures, new 3D structures within the chip, the integration of new materials, new ways to shrink including EUV and self-aligned patterning, and advanced packaging techniques to connect chips together in new ways. All five of those areas require major advances in materials engineering and create great growth opportunities for Applied. As a result of that, we're creating new and unique capabilities for the industry, investing in the META Center to accelerate materials to systems, where there's tremendous value and developing entirely new types of products that move the needle for our customers and for Applied.