Lip-Bu Tan
Analyst · Wells Fargo
Good afternoon, everyone, and thank you for joining us today. I'm pleased to report that Cadence achieved outstanding financial results for the third quarter of 2020. We exceeded our financial outlook on all key metrics as the Cadence team continues to successfully navigate through challenges posed by the pandemic. We also raised our outlook for the year. John will provide more details in a moment. The data centric revolution led by AI, data analytics, hyperscale computing continues to fuel strong semiconductor and system design activity. And our Intelligent System Design strategy uniquely positions us to enable our customers to accelerate their innovation. Now let us move on to the major highlights for the third quarter. Design Excellence is the foundational layer of our strategy and includes our core EDA chip design solution and IP portfolio. We significantly deepened our partnership with a global marquee customer through our wide ranging expansion of our EDA software and hardware portfolio. This customer is now accelerating the proliferation of our digital flow across their design teams. Momentum continued for our digital & signoff solutions with 9 full-flow wins and a market shaping auto maker taped out their highly innovative and complex 7-nanometer design using our digital full flow. Our Verification Suite comprised of best in class core engines across simulation, formal analysis, emulation and prototyping, is particularly well suited to address our customers mounting verification challenges. Hardware had its highest-ever revenue quarter, with Palladium Z1 and Protium X1 continuing to get new design wins and significant expansions, particularly at AI and hyperscaler customers. We introduced Xcelium ML, which uses machine learning to improve the regression throughput of our premier logic simulator by up to 5X. On the IP front, the top vertical end-markets for our Design IP in the quarter were hyperscale, enterprise and automotive, with a major hyperscaler adopting our PCIe and high bandwidth memory IP for use in 3-nanometer designs. Tensilica had strong royalties and wins for true wireless stereo and functional safety applications and was adopted by an automotive company for ADAS. In System Innovation, I’m very excited by the strong momentum of our new system products, both organically developed, as well as those we obtained through the AWR and Integrand acquisitions earlier this year. Earlier this month, we expanded our System Analysis portfolio with the addition of the Clarity 3D Transient Solver that delivers up to 10x faster system level EMI simulation. Clarity and Celsius continued to ramp nicely with broadening adoption, particularly in verticals such as AI, mobile and hyperscale segments. Systems companies like Teradyne and Rockley Photonics are deploying our Clarity EM simulator for production use. In the 5G/millimeter wave area, integration of our AWR and Integrand acquisitions continues smoothly, and the business is tracking ahead of our internal expectations. In Q3, we added more than 15 new customers in end markets that included 5G, automotive and aerospace & defense. Cadence has a long successful history in advanced packaging, which has become a linchpin technology for many systems companies, particularly automotive and hyperscalers, to deliver complex system level chip designs. In Q3, our innovative Allegro technology was used by a market shaping auto maker for their wafer level system packaging needs. Now, let us turn it over to John to go over the results in more detail and to update our outlook.