Well, so if you go back in time for our industry, the wafer cost for every new generation goes up. And the reason it goes up is because we've always added new materials in order to help with performance and density and also minimize the power consumption. So you've seen us add low-k dielectrics, copper, barrier metals, now high-k. You're doing double patterning, which means you're moving through the steppers a couple of times in order to create a critical layer. We're moving the FinFETs. Each of these have more processing steps on more expensive equipment. And fundamentally, the wafer cost goes up. In the past, what happened is by moving forward, of course, you were able to shrink your die and that more than made up for the increase in the wafer costs when you look at the die costs. Because again, you were shrinking the die enough that it more than made up for the fact that the wafer was more expensive. Now and generally, you're finding that, that formula does not work with a few exceptions. Cost is an exponential curve based on die size. As you get to the larger die sizes, that's where that you really start to get on the sort of exponential end of the cost curve. PLDs are large die. So we still have the ability, even with the significant increase in wafer price going from 40 to 28 to now 20 to FinFET technology to achieve a very significant die-size reduction, and because we're on that exponential part of the curve with an increase in wafer price, we more than make up for it with our die-size reduction. And as such, we still have the ability to push forward the new generations and achieve a total cost reduction of our silicon. Most ASSPs, I think, are going to be challenged, which is why you hear some of the discussion of -- out of other semiconductor companies saying that, that avenue of moving to the next generation to achieve the cost reduction is no longer there for us. It's still absolutely intact for our industry. And because it's intact, we are aggressively moving forward with 20, and we're aggressively pushing into FinFETs. And by moving to the new next node and reducing our costs and increasing our complexity and performance, we're able to displace more ASICs, ASSPs and microprocessors. So it continues to fly well. So overall, you're right that the costs are going up. They have been for a long period of time. I think that inflection is starting to change many semiconductor businesses. But the base PLD business, pieces is still absolutely intact. We can move forward. And by doing so, again, we open up a lot more market and can grow faster.