Michael Plisinski
Chief Executive Officer
Yeah, for sure. We think we have the announcements baked in to our commentary. I did mention in the prepared remarks that DRAM would be down, but offset by continued strength in NAND and logic, particularly for the advanced nodes. So barring future surprises, wheels falling off the bus kind of thing, our channel checks our discussions with the customers. We're pretty confident the visibility we have, the fact that the book-to-bill was continued to be higher, over 1, leads us to believe we're still in an environment where the equipment is in high demand. For us, it's not just the volume. We're also tied to several technology transitions, not just with the transistors, the nanosheet, or the sub 5 nanometer, but also with certain DRAM transitions, 1A, 1B, they all have different names, but there's some DRAM technology transitions, as well as, of course, the 3D NAND, the high stack 3D NAND we've been talking about. Flipping to specialty and advanced packaging, you're right. We do see some opportunities with the lithography, with some of the new products, certainly the high demand of the Dragonfly looks to be very solid. And we've talked about pretty strong backlog in the wafer manufacturing space. So, the very conservative way for manufacturers driving expansions to support the growing demand for EUV wafers and our position for process control solutions and material solutions to serve that market. So, you take all these different shots on goal and you can add them up and take a factor for some of the negativity and we still see the stronger second half and some of the numbers we talked about for growth – 30% advanced node systems and 20% or more for packaging and specialty.