Chris Progler
Analyst · Northland.
Okay, sure. I mean we use a relatively broad definition of mainstream today, which is up to but not including 28-nanometer node. So quite broad. But if you wanted to break that down and define our categories, you would have, let's say, mature legacy 90-nanometer, 110-nanometer maybe even greater, and then kind of midrange nodes, 40, 55. There are steps in the masks technology between those that bring different sorts of value. So mainstream, for us, at least the way we talk about in this context is quite broad. And then our high-end at least today generally starts in 28 and goes down. As far as packaging lithography, there's kind of 2 trends that have unfolded in the last, I would say, 3 to 5 years. One was the effort to try to do packaging lithography on larger substrates. This is so-called panel or package on panel. And we were starting to see that substrate scaling, midrange masks, 9, 14-inch masks, which is significantly larger than IC size masks. We still see some of that. But what we're finding, the stronger trend, particularly on the leaders now is wafer-level packaging. So going back to standard sized IC mask and kind of doing it at wafer-level scale. That trend is much stronger now, especially at the high end of packaging. And the types of ground rules you see there in the very, very low-end case, 40, 50-micron types of via holes and things like that, down to a few microns at mask level for wiring and that sort of thing. So in that context, we'd be a relatively mainstream mask technology. But there are some unique characteristics of those packaging masks that allow some technology injection into them and some differentiation. It has to do with the substrates. The substrates are very warped. The way you have to control the CDs on the masks, the way these masks are integrated into lithography is somewhat unique. So the dimensions are large, but there are some packaging-specific technologies that need to be developed to serve that market, and we are working on them.