Jon Kemp
Analyst · Goldman Sachs
Thank you, Meg, and good morning, everyone. Let me start by introducing you to Ken Rizvi, our new CFO. Ken brings a proven track record as a public company CFO as well as significant experience in the semi industry. While Ken has only been with us a few weeks, it's clear that he shares our commitment to growth, operating discipline and long-term value creation. He's already been engaging closely with our team, and I'm pleased to have him with us today as we build on the progress of our first year as an independent company. Over the past 12 months, we've executed a focused strategy that builds on more than 50 years of technology leadership to become the premier solutions provider across the semiconductor value chain. That strategy is delivering results as AI accelerates two industry shifts, shrink and stack. The next era of computing is being shaped, not only by smaller, more powerful chips, but also by stacking more of them into 3D architectures. As designs add layers and complexity, materials intensity multiplies, making our innovation even more critical to performance, yield and reliability. This is a powerful long-term growth driver and means more opportunity for Qnity content in every device. Our broad portfolio, deep customer relationships and local execution model enable us to engage early with system-level solutions from the front end to the back end. As the pace and magnitude of industry capital investments increase, this means additional content and share gain opportunities. As customers scale, our design win enables durable growth and attractive returns for our shareholders. Our third quarter results provide clear evidence that this strategy is translating into strong financial performance. Net sales were $1.6 billion, with organic growth of 22% year-over-year. Adjusted operating EBITDA was $503 million, growing 36% year-over-year. And adjusted earnings per share increased 55% year-over-year to $1.46. This marked our tenth consecutive quarter of profitable organic growth, reinforcing our technology leadership and consistent execution. In Semiconductor Technologies, we had strong performance with organic sales growth of 16% year-over-year and an adjusted EBITDA margin of 36%. Advanced Logic and Memory remained impactful drivers of our strong quarterly results, higher fab utilization and advanced node scaling drove demand for our semi fab materials. In addition, demand for Kalrez, our semiconductor equipment consumables business, primarily tied to deposition and etch has grown significantly this year. Interconnect Solutions had another great quarter with organic sales growth of 29% year-over-year and an adjusted EBITDA margin of 31%. Thermal management, advanced packaging and AI printed circuit boards remain the segment's fastest-growing platforms driven by AI tailwinds and rising data center demand. Our third quarter results show that we're executing well. Our technology is delivering value for customers and the transition to shrink and stack is creating meaningful opportunities for our business. Qnity has one of the industry's broadest material solutions portfolios, spanning front-end materials used to manufacture advanced chips through back-end Advanced Packaging, Interconnect and Thermal Solutions. That breadth positions us to solve increasingly complex challenges across the chip and broader system. In advanced packaging, Qnity is helping drive a major shift in semiconductor performance. Our integrated platform spans semi-fab materials like CMP and lithography as well as interconnect materials like plating technologies, dielectrics and fine line patterning. These solutions enabled a high-performance integration and complex manufacturing processes required for advanced packaging architectures like CoWoS, EMIB and HBM. Increasing materials intensity expands our content per package, enabling Qnity to grow faster than overall package volumes. We're also working with customers earlier in the design process than ever before on future architectures like panel-level packaging, hybrid bonding and glass core substrates. Those earlier conversations allow us to bring our industry-leading portfolio and deep engineering expertise together into system-level solutions that help customers improve yields, accelerate development and scale next-generation architectures. Thermal management is our fastest-growing platform and has become fundamental to AI performance. For example, as more powerful logic chips and memory modules are tightly packed into AI applications, heat builds quickly and can limit performance and reliability. Our expansive portfolio manages heat at every level from the chip and memory components to the board and broader system, giving us more opportunities to help customers optimize system efficiency and maximize AI compute. Our decade-long experience gives us a deep understanding of customer road maps and where devices are headed so we can bring together the right materials and engineering expertise for their most critical solutions. Through Apple's American Manufacturing Program, we're advancing materials and technologies for semiconductor manufacturing and advanced electronics, including Qnity's U.S.-produced camera film for the variable aperture camera system in the iPhone 18 Pro? The innovation examples I shared become a lasting growth engine when our materials earn a place in a customer's manufacturing process. That's the power of a process of record or POR win and why they're at the heart of our business model. Once our material is qualified in a customer's process, it can generate repeatable revenue through the life of that technology. Here's what that means. On average, our PORs last 5 to 10 years and as production scales, every wafer or system creates steady, repeatable demand. Let me give you one example of how we're seeing that model play out today. We've secured multiple POR wins across today's leading technologies for advanced nodes, advanced packaging and thermal management. These wins are driving substantial growth with more capacity still to come, both this year and in 2027. More recently, we've strengthened our leadership position with an increasing number of significant POR wins for 2-nanometer and HBM4, which are now entering production. Each technology transition results in higher materials intensity and more content per wafer. We are actively engaged in the next wave of growth with the new generations of advanced logic and memory. Overall, we're on pace to exceed last year's record POR wins with the majority tied to shrink and stack inflections. That progression from early customer engagement to qualification, production and years of repeatable revenue gives us confidence in durable multiyear growth across the stack. Beyond our leading POR positions, the industry trends we're seeing reinforce our confidence in the growth trajectory ahead. First, healthy customer utilization is supporting demand for our consumables today. Advanced logic and DRAM fabs are tracking in the high 80% range, while NAND and mainstream logic continue to improve with most customers in the low to mid-80s. Second, customers are investing in new capacity to address strengthening demand across the semiconductor value chain. We're tracking more than 15 advanced fabs and a handful of mature node fabs with production targeted within the next year. For our business, the key timing is when those facilities start running wafers. Once equipment is installed, process qualification can take 12 to 18 months. From there, materials demand builds as customers ramp toward full capacity. While the scale of the industry build-out is significant, the increase in total wafer volume will come over time. For Qnity, that creates a multiyear opportunity as our qualified material scale with customer production and reinforces our confidence over the long term. Finally, AI adoption is broadening beyond data centers into physical AI across factory automation, aerospace and defense and autonomous driving. Our materials help enable these applications, extending our growth opportunities across a more diverse set of end markets. Now let me pass it over to Ken to cover our results in more depth.