Andy Pease
Analyst · Roth Capital
Thank you for joining us this afternoon. During our October conference call, I described the expansion of our ArcticLink III strategy to include bridge-only display solutions. We tested the strategy during Q3 and implemented it during Q4. During implementation we ran into unexpected technical difficulties that significantly limited the number of opportunities we could address. This was the most significant contribution to missing our Q4 new product revenue guidance. Since then we have implemented engineering support process changes that enable us to keep pace with demand. We now have a record number of ArcticLink III designs and process with several in the final stages of design verification. Through this increase in design activity and our process changes, I am optimistic that we will report substantial new product revenue growth for the full year of 2013. The trend in the smartphone and tablet markets is the ability of mobile devices to support a video connection to TVs. The challenge for some application processors is to simultaneously have two display paths, one for their native onboard display and the other to stream the same content to a TV via an HDMI or MHL interface, our ArcticLink III solution that supports dual-display paths is perfectly suited for this application. We are currently supporting a customer evaluation on this solution and exploring potential for processor reference designs. In addition to the increase in opportunities for our ArcticLink III solutions in smartphones and tablets, we are developing new sales opportunities for our solutions in the digital camera market. The rapid transition in the smartphone market to the MIPI display standard is creating a design challenge for digital camera manufacturers. The challenge here is the processors used in digital cameras only support a RGB bus. Therefore, to take advantage of the dropping prices of MIPI displays, digital camera manufacturers will need to use a display bridge. This opens a new high-volume market for ArcticLink III BX family and has given digital camera OEMs the opportunity to evaluate our VEE technologies offered in our pin-for-pin compatible ArcticLink III VX family. In addition to high-level design activity achieved with our ArcticLink III solutions, we gained qualified vendor list or QVL approval for our platform with a second major application processor supplier. This significantly broadens our exposure to end-customers in key emerging markets and covers smartphone and tablet applications. Shipments into the pico projector market remains small, but that is indicative of the market than anything else. General imaging, which uses our ArcticLink II VX solution in its iPico project is still working through inventory we shipped to support its predecessor PoP Video. We are told the market acceptance for the iPico is good relative to the pico projector market, but we don't have enough visibility to forecast any meaningful new revenue in the near term. Platform Development or PDI developed two prototype pico projectors using ArcticLink II VX, but has moved to an intellectual property licensing model and has decided to shelf plans to sell pico projectors directly. As you may recall, PDI licensed General Imaging for the technology used to launch its iPico projector. There were two VEE-enabled pico projectors shown at the January Consumer Electronics Show in Las Vegas. One was from DigiLife which introduced a VEE-enabled pico projector camcorder combo based on Texas Instruments' DLP light engine. We remain engaged with a number of major companies in the pico projector and light engine market. We believe our VEE and background color compensation, or BCC technology, which adjusts the color output to compensate for non-white projection surfaces, are game-changers and essential for the pico projector market. Summarizing our display activities, we made substantial progress in developing our opportunities for our ArcticLink display products during 2012 and continue to build on this momentum in 2013. We received orders from three new display customers at the end of last quarter and currently have more opportunities for the ArcticLink III family than any previous CSSP family this early in the product life. We successfully cultivated a new relationship with a major silicon supplier and we have more quantifiable interest from name brand smartphone and tablet OEMs than we've ever had before. In addition to these opportunities, we are optimistic that the design trends we are seeing in the digital camera market will open new opportunities for our ArcticLink platform and that VEE and BCC have the potential to become checkbox design requirements for the pico projector OEMs. Over the past several quarters we have made significant progress with our connectivity solutions. During our last conference call, I stated that we initiated shipments to support a new handset connectivity design during Q3. This CSSP is in the Kyocera Honey Bee 5 PHS handset. PHS is a cost-effective communication standard used in Japan and Kyocera dominates the market with roughly an 80% share. Also noted during our October conference call was the second connectivity design win. This design is in the Kyocera new Stola PHS handset which utilizes two QuickLogic CSSPs. We have initiated production shipment to support this design. While annual volume for a PHS handset is lower than a typical smartphone design, the lifecycle is significantly longer. During Q4 we won a handset connectivity design what we expect to enter production during Q2. During the first month of Q1, we won another handset connectivity design that we expect to enter production during Q3. I look forward to providing additional color on these production wins during future conference calls. We launched our catalog CSSP strategy last July and have been working closely with Texas Instruments Embedded Processor Group to develop new CSSPs for applications using one TI's new embedded processors. This relationship has resulted in the camera interface reference design. We expect to receive our first production order from this reference design later this month. Our relationship with TI is developing very well, and based on meetings we have last week with senior management, I expect to announce additional reference designs in 2013. In addition to broadening our partnership with TI, we are actively engaged with several other processor companies that are addressing different sectors within the broad embedded processor market. While individual design wins in these markets will typically yield lower volume than designs in the smartphone and tablet markets, product lifecycles are usually significantly longer. Due to these factors and the inherently lower volatility we anticipate from these markets, we view our catalog CSSP strategy as a way to diversify our end-market exposure with the broad foundation of business. However, due to the long design cycles common in the embedded market, building this business will take some time and we are forecasting only modest revenue contributions during 2013. Our work with CertiVox to jointly develop multifactor security systems based on CertiVox's PrivateSky software and our ArcticLink II CX platform is continuing. During the first phase of our partnership, the focus was on high-level definition. We have completed that phase and are working closely together on our first customer-specific design. Design and qualification cycles from the security industry are long and somewhat unpredictable. Consequently, we are not at the point where we can forecast material revenue contributions from this partnership. Over the last three-and-a-half years, connectivity solutions to support our processor partner in the wireless data card segment contributed significantly to our new product revenue. This was a very successful program and represented our first major partnership with a processor supplier. As I have discussed in previous calls, we are now at the end of volume shipments in this market. However, we believe the flow of new opportunities we're seeing today will more than offset the loss of data card revenue and result in significant year-over-year growth for our new products in 2013. Let me turn the call back over to Ralph for Q1 guidance, and I will rejoin for my concluding remarks.