Patrizio Vinciarelli
Analyst
So there is a broad range of requirements and to go with that broad range of capabilities, obviously, we've had success stories with what we call lateral PDNs or lateral power delivery. And we've had the success stories competing with the competitive alternative of, if you will, what's called the intermediate bus architecture and back converter, some multi-phase regulators. So that's been the landscape for the most part over the last 10 years, more systems have been lateral. At the other end of the spectrum, we worked with some industry pioneers on fully vertical systems. Those are still what you might call leading-edge initiatives. They involve stacking our chips, and they've been supportive to a limited degree, leveraging some of our older technology. And without the benefit when it comes to the packaging of the vertical integration, we are soon going to be able to nearly fully deploy. But they have demonstrated the kind of capability that's going to become necessary to support wafer scale and cluster computing in leading-edge applications that the industry at large will require, as lithography gets financed, you get even below 5-nanometer and the current levels get up into the several thousand amps. And then you get, in effect, two intermediate PDN architectures, one we call lateral vertical and another one, we call vertical lateral. As you can imagine from the sequence, the lateral vertical is still mostly lateral, but deploys a vertical component on the other side of the substrate to provide for typically one-third of the current requirements of a primary ramp. That's relevant because it makes a very substantial difference in terms of PDN losses and system capability in the 1,000 amp, 1,500 amp range. Above the current level, vertical lateral becomes a necessity, because even the deployment of a vertical component isn't enough in order to provide the current density and bandwidth and overall system efficiency that is necessary by systems in the, let's say, 2,000 amp, 3,000 amp total power range. So again, you have a broad range of requirements and with it, evolving landscape ranging from pure lateral, which is, in effect, becoming a thing of the past to lateral vertical, which is becoming a necessity in the 1,000 amp, 1,500 amp range to vertical lateral as you get above that. And then when you get to powering, let's say, wafers that may consume 50,000 amps, 100,000 amps, there is no alternative to pure vertical. And we're on the forefront of that technology as well. And with our 5G capabilities, we're going to get to, generally speaking, much higher level of current density and performance with those applications as well as the vertical lateral and the lateral vertical.